MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste

Epoxy Compounds, EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20

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Item number:: WS08400014
Manufacturer number:: 925392
Content:: 0.486 kg
Minimum purchase:: 2
Weight:: 0.486 kg
Best before date:: 03.02.2029

MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste

BP20 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites and metal.
Fast curing bonding and repair of composite structures, bonding of composites and metal consisting of EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20.
Manufacturer: Westlake

Datasheets

Safety-Datasheet-A (PDF)
Safety-Datasheet-B (PDF)