3M Scotch-Weld Structural Adhesive Film AF 3109-2U .035wt, 48 in x 25 yds, 1 per case

Ready to Fly 3M Scotch-Weld Structural Adhesive Film AF 3109-2 provides excellent performance with easy-to-use shop handling properties. These adhesive films are available in a variety of weights and carriers to meet a range of needs without imposing excess material costs. With high fracture toughness and peel strength, AF 3109-2 provides a reliable, long-term bond suitable for composites, metals in solid panel and honeycomb sandwich fabrication. We also offer an unsupported version, which can be used for reticulation. It is also compatible with multiple substrates and primers. In addition, AF 3109-2 exhibits excellent pre-bond humidity performance on composite substrates. The following 3M primers are compatible with AF 3109-2: 3M Scotch-Weld Structural Adhesives Primer EW 5000 3M Scotch-Weld Structural Adhesives Primer EW 5000 AS 3M Scotch-Weld Structural Adhesives Primer EW 5000 ET 3M Scotch-Weld Structural Adhesives Primer EC 3917 3M Scotch-Weld Structural Adhesives Primer EC 3924 B Our heat-curing, easy handling film is designed to meet numerous customer specs in aerospace manufacturing. AF 3109-2 supplies high fracture toughness and peel strength through a spectrum of environmental conditions and is easy to work with. Once cured it provides high bond strength from -67°F to 300°F (-55°C to 150°C) for use in multiple designs through multiple environments. What is Structural Adhesive Film? The fewer rivets you have in your aircraft the better. Structural adhesive films enable the designer to get more innovative with their parts, and reduce the overall number of rivets required on your structure. This thermosetting modified epoxy in film form can be used for bonding a wide variety of substrates, including metal, honeycomb and composite. Structural Adhesive Films come in a variety of weights and thicknesses, minimizing the weight while maintaining the structural integrity. The films are available in supported versions, which are typically used fo