MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste
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Minimum purchase: 3 pc(s).
Epoxy Compounds, EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20
Ready for shipment 10 Workdays
- Item no.: WS08400014
BP20 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting... more
Product information "MGSBP20 /TD80 0,486 KG Cartridge, epoxy-based bonding paste"
BP20 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites and metal.
Fast curing bonding and repair of composite structures, bonding of composites and metal consisting of EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20.
Manufacturer: Hexion
Fast curing bonding and repair of composite structures, bonding of composites and metal consisting of EPIKOTE resin MGS BPR 20 and EPIKURE curing agent MGS BPH 20.
Manufacturer: Hexion
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