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MGSDRILLFILL20 / TD00 0,435KG laminating resin system

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MGSDRILLFILL20 / TD00 0,435KG laminating resin system
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Epoxy-based solvent-free laminating resin system with the constituents EPIKOTE Resin MGS DFR20 and EPIKURE Curing Agent MGS DFH20

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  • WS08400011
MGS DRILLFILL20 is an epoxy-based solvent-free laminating resin system with the constituents... more
Product information "MGSDRILLFILL20 / TD00 0,435KG laminating resin system"
MGS DRILLFILL20 is an epoxy-based solvent-free laminating resin system with the constituents EPIKOTE Resin MGS DFR20 and EPIKURE Curing Agent MGS DFH20. It is a higher viscous liquid resin with adhesion properties and the intended main application is the filling of gaps and cavities., Manufacturer: Hexion
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