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BP10 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting... more
Product information "MGSBP10 926140 5.832 KG Epoxy bonding paste"
BP10 is a solvent-free epoxy-based bonding paste which was especially developed for fast setting bondings in composites applications and for bondings of composites. Performance on metal surfaces should be thoroughly tested in the individual application. BP10 has a good degree of cure even at lower ambient temperatures., Manufacturer: Hexion
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